Areal Confocal 3D Microscope
BDT 0/-
Product Details
Brand: INSIZE
Model: ISM-A7000
Country Of Origin: China
Features:
Used to wafers, substrates, HDI boards, flexible printed circuits, glass wafers, glass substrates, microprisms, PV panels, Li batteries and etc.
Suitable for critical dimension measurement of semiconductor wafer patterns, solder ball, probe indentation and MEMS device.
Using structured light illumination and vertical axial scanning to realize micro-surface 3D topography.
Sub-nanometer vertical resolution.
Motorized XY stage.
The Z-axis motor driver and piezoelectric ceramic (PZT) are adjustable.
Including mountains analysis software; measurement results can be exported as reports.
The 3D tilt measurement angle is up to ±60°.
Supportint focus stacking, motorized XY stitching, and measurement after stitching (Note: "Supportint" is transcribed exactly as seen in the image).
Capable of measuring workpieces with a maximum aspect ratio of 1:10.
Supporting color imaging and 2D/3D observation, synchronously outputting 3D point cloud data, 2D color images and focus-stacked images.
Single-field-of-view measurement of multi-material and multi-color surfaces, compatible with reflective, metallic, highly reflective and transparent substrates.
| Measuring Principle: | White light area confocal |
| Z-Axis Resolution: | 0.01Âĩm (PZT), 0.1Âĩm (Motor) |
| XY Stage Range: | 100Ã100mm (Motorized) |
| Camera Resolution: | 1920Ã1200 |
| Dimensions: | 380Ã410Ã750mm |
| Net Weight: | 55kg |
The INSIZE ISM-A7000 Areal Confocal 3D Microscope is a high-performance, non-contact metrology system designed for sub-nanometer 3D surface topography and critical dimension measurement. Utilizing white light area confocal technology combined with a precision piezoelectric (PZT) Z-axis scanner, it delivers exceptional vertical resolution (down to 0.01µm) and rapid 3D point cloud generation.
This advanced microscope is highly versatile, catering to the semiconductor, electronics, and materials industries. It is ideal for inspecting wafers, HDI boards, flexible printed circuits, glass substrates, and MEMS devices. The system features a motorized XY stage and supports focus stacking and motorized stitching for large-area analysis. It excels at measuring highly reflective, metallic, and transparent substrates, as well as high-aspect-ratio features (up to 1:10). Complete with a powerful analysis software suite (including Mountains analysis software) and a handheld controller, the ISM-A7000 provides comprehensive 2D/3D imaging, roughness evaluation, and cross-section profiling in a compact, user-friendly package.
INSIZE ISM-A7000 Areal Confocal 3D Microscope – Advanced Sub-Nanometer Surface Metrology
Achieve the highest level of precision in non-contact surface measurement with the INSIZE ISM-A7000 Areal Confocal 3D Microscope. Engineered for the semiconductor, microelectronics, and advanced materials industries, this state-of-the-art system combines white light area confocal technology with a dual Z-axis scanning mechanism (PZT and motor) to deliver sub-nanometer vertical resolution (0.01µm) and highly accurate 3D topography.
Key Features & Benefits:
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Ultra-High Precision Imaging: Features a 1920x1200 resolution camera and supports 2D/3D color imaging with a tilt measurement angle of up to ±60°. The PZT scanner provides a 500µm scanning range with 0.01µm resolution, ideal for smooth surfaces and microstructures.
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Versatile & Robust Measurement: Capable of measuring a vast array of substrates including wafers, HDI boards, flexible circuits, glass, and PV panels. It handles highly reflective, metallic, and transparent materials seamlessly, and can measure high aspect ratio features (1:10) such as deep vias and probe indentations.
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Fully Automated XY Stage: The motorized XY stage (100x100mm range) allows for automated focus stacking, image stitching, and multi-point measurement, drastically improving throughput for batch inspections.
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Powerful Analysis Software: Comes equipped with comprehensive acquisition and analysis software. It automatically calculates areal (Sa, Sq) and profile (Ra, Rz) roughness, measures critical dimensions (copper width/spacing, via depth), and outputs detailed reports including point clouds and 3D topography charts.
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Complete Turnkey Package: Standard delivery includes the main unit, 20X objective, industrial computer, handheld controller, and full software suite. A range of optional 5X to 100X objectives is available for ultimate magnification flexibility.
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100% Viscose Fabric.
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